Membrana termica 8" x 12" x 2mm
Typical Applications Include:
• Telecommunications • Computer and peripherals • Power conversion • RDRAM™ memory modules / chip scale packages • Areas where heat needs to be transferred to a frame chassis or other type of heat spreader Gap Pad 1500 has an ideal filler blend that gives it a low-modulus characteristic that maintains optimal thermal performance yet still allows for easy handling.The natural tack on both sides of the material allows for good compliance to adjacent surfaces of components, minimizing interfacial resistance.
• Telecommunications
• Computer and peripherals
• Power conversion
• RDRAM™ memory modules / chip scale packages
• Areas where heat needs to be transferred to a frame chassis or other type of heat spreader
Gap Pad 1500 has an ideal filler blend that
gives it a low-modulus characteristic that
maintains optimal thermal performance yet
still allows for easy handling.The natural tack
on both sides of the material allows for
good compliance to adjacent surfaces of
components, minimizing interfacial resistance.
